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Thermaltake Passive 2U Heat Sink / For Intel Xeon Dempsey CL-P0389

Price:
 $17.85
MPN:
 CL-P0389
Brand:
Condition:
 NEW
Availability: Ships in 2 business days
Ships in 2 business days
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Product Description

Application for Intel Woodcrest 1U Passive Solution
All Aluminum fin and base soldering Technology
High density fins provide better heat dissipation
Dow Corning 5022 Interface material performs well

  
Socket Type    LGA 771
Compatibility    Intel Xeon Woodcrest / Clovertown Series:
Intel Xeon 51XX Series
Intel Xeon E5300 Series
Intel Dual Core Xeon DP
Intel Qual Core Xeon
(1333MHz / 1066MHz FSB)
Heatsink Dimension    88.9 x 78.7 x 27 mm
Heatsink Material    Aluminum Base w/ Aluminum Fin
Fan Dimension    ----
Fan Speed    ----
Air Flow    ----
Air Pressure    ----
Noise Level    ----
Consuming Power    ----
Consuming Current    ----
Connector    ----
Bearing Type    ----
MTBF    ----
TIM    Dow Corning TC-5022

Other Details

MPN:
CL-P0389

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