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| Application for Intel Woodcrest 1U Passive Solution | |
| All Aluminum fin and base soldering Technology | |
| High density fins provide better heat dissipation | |
| Dow Corning 5022 Interface material performs well |
| Socket Type | LGA 771 |
| Compatibility | Intel Xeon Woodcrest / Clovertown Series: Intel Xeon 51XX Series Intel Xeon E5300 Series Intel Dual Core Xeon DP Intel Qual Core Xeon (1333MHz / 1066MHz FSB) |
| Heatsink Dimension | 88.9 x 78.7 x 27 mm |
| Heatsink Material | Aluminum Base w/ Aluminum Fin |
| Fan Dimension | ---- |
| Fan Speed | ---- |
| Air Flow | ---- |
| Air Pressure | ---- |
| Noise Level | ---- |
| Consuming Power | ---- |
| Consuming Current | ---- |
| Connector | ---- |
| Bearing Type | ---- |
| MTBF | ---- |
| TIM | Dow Corning TC-5022 |