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Application for Intel Woodcrest 1U Passive Solution | |
All Aluminum fin and base soldering Technology | |
High density fins provide better heat dissipation | |
Dow Corning 5022 Interface material performs well |
Socket Type | LGA 771 |
Compatibility | Intel Xeon Woodcrest / Clovertown Series: Intel Xeon 51XX Series Intel Xeon E5300 Series Intel Dual Core Xeon DP Intel Qual Core Xeon (1333MHz / 1066MHz FSB) |
Heatsink Dimension | 88.9 x 78.7 x 27 mm |
Heatsink Material | Aluminum Base w/ Aluminum Fin |
Fan Dimension | ---- |
Fan Speed | ---- |
Air Flow | ---- |
Air Pressure | ---- |
Noise Level | ---- |
Consuming Power | ---- |
Consuming Current | ---- |
Connector | ---- |
Bearing Type | ---- |
MTBF | ---- |
TIM | Dow Corning TC-5022 |