The radiator is optimized for efficiently pulling heat away from the power-dissipating components thus achieving maximum heat dissipation at both low and high airflow operation. After soldering, the fin and tube connect to form a joint, thereby creating uniform heat transfer.
To assure the best thermal capacity and increase heat transfer, the Pacific C360 is engineered with a 27mm thickness radiator along with a 12-set flat tube design and brass tank. This technique allows that water flows down on the one side, and then passes across the bottom chamber before circulating back to the other side of the radiator.
Fin density is optimally designed to accommodate high air volume (FPI: 17). The performance improves significantly with increased fan speed, offering superior cooling efficiency during operation.
Unlike most of copper radiators on the market, the radiator utilizes stainless steel made side panels that increase the durability and strength of the radiator while reducing the weight.
High-Quality Manufacturing Process: Reflow Soldering
Designed for 120mm high-static pressure fans, the Pacific C Series allow users to build up aesthetically-superior watercooled PCs as well as incorporate externally-modular upgrades for the systems, delivering the ultimate in custom configurations.
P/N | CL-W227-CU00BL-A |
---|---|
DIMENSION | 279(L) x 119 (W) x 29.5 (H) |
WEIGHT | 562 g |
MATERIAL | Copper |
FPI (FIN PER INCH) | 17 |
FLAT TUBE | 12 set |
SCREW THREAD | G¼” * 2 |