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Features
Application for Intel LGA775 Performance 115W |
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All copper base & Copper Fins Skived Technology |
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Shin Etsu-G751 interface material, made perform well |
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Bundle with LGA775 back plate |
Socket Type |
LGA 775 |
Compatibility | Intel Xeon Conroe / Wolfdale / Kentsfield / Yorkfield Series: Intel Xeon 3000 Series (65W, 100W / 105W, 115W) Intel Core 2 Duo Series (65W, 100W / 105W, 115W) (1333MHz / 1066MHz FSB) |
Heatsink Dimension | 90 x 90 x 13.5 mm |
Heatsink Material | Copper Base w/ Copper Fin |
Fan Dimension | 70 x 70 x 10 mm |
Fan Speed | 4800 ± 10% RPM |
Air Flow | 28.7 CFM |
Air Pressure | 3.34 mm H2O |
Noise Level | 40.3 dBA |
Consuming Power | 5.4 W |
Consuming Current | 0.45 A |
Connector | 3 Pin |
Bearing Type | 1 Ball |
MTBF | 50,000 Hrs |
TIM | Shin Etsu G751 |