Loading... Please wait...Sorry but this item is currently unavailable.
Please check back at a later stage.
Features
| Application for Intel LGA775 Performance 115W |
|
| All copper base & Copper Fins Skived Technology |
|
| Shin Etsu-G751 interface material, made perform well |
|
| Bundle with LGA775 back plate |
| Socket Type |
LGA 775 |
| Compatibility | Intel Xeon Conroe / Wolfdale / Kentsfield / Yorkfield Series: Intel Xeon 3000 Series (65W, 100W / 105W, 115W) Intel Core 2 Duo Series (65W, 100W / 105W, 115W) (1333MHz / 1066MHz FSB) |
| Heatsink Dimension | 90 x 90 x 13.5 mm |
| Heatsink Material | Copper Base w/ Copper Fin |
| Fan Dimension | 70 x 70 x 10 mm |
| Fan Speed | 4800 ± 10% RPM |
| Air Flow | 28.7 CFM |
| Air Pressure | 3.34 mm H2O |
| Noise Level | 40.3 dBA |
| Consuming Power | 5.4 W |
| Consuming Current | 0.45 A |
| Connector | 3 Pin |
| Bearing Type | 1 Ball |
| MTBF | 50,000 Hrs |
| TIM | Shin Etsu G751 |