ENZOTECH MST-66 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-66 heatsink is made by using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MST-66 heatsink is far superior compared to traditional heat sinks currently found in the market. It provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.
Dimensions (mm)
|
72(L) x 13(W) x 29.6(H) |
Material
|
C1100 Forged Copper |
Weight
|
55g |
Thermal Adhesive
|
Fujipoly GR-d Thermal Tape |