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ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1-LE heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.![]()
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| 
 Dimensions (mm) 
 | 
6.5(L) mm x6.5mm(W) x12mm(H) | 
| 
 Material 
 | 
C1100 Forged Copper | 
| 
 Finish 
 | 
Matt Black | 
| 
 Weight 
 | 
2g (Each) | 
| 
 Thermal Adhesive 
 | 
3M™ 8815 Thermal Tape |