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ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1-LE heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.![]()
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Dimensions (mm)
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6.5(L) mm x6.5mm(W) x12mm(H) |
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Material
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C1100 Forged Copper |
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Finish
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Matt Black |
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Weight
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2g (Each) |
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Thermal Adhesive
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3M™ 8815 Thermal Tape |