![]() |
![]() |
![]() |
![]() |
CPU Socket | 1155/1156/1150 |
![]() |
|
CPU Support | LGA1155: Intel® 3rd. Generation Core™ i3/i5/i7 Desktop Processors |
![]() |
|
LGA 1156: Previous Generation Core™ i3/i5/i7 Desktop Processors LGA 1150: support up to TDP 65 Watts |
|
![]() |
|
Solution | Mini-ITX Form Factor (with chassis height 2-inch and up) |
![]() |
|
Overall Dimension | ø93.0 x 31.0 mm |
![]() |
|
Weight | 185g |
![]() |
|
Material | Aluminum 6063-T5 extruded radial fin heatsink |
![]() |
|
Fan Dimension | 80 x 80 x 15 mm |
![]() |
|
Speed | At Duty Cycle 20%: 800 RPM At Duty Cycle 50%: 1500 RPM At Duty Cycle 100%: 2500 RPM |
![]() |
|
Bearing | 2 Ball Bearing |
![]() |
|
Rated Voltage | 12 V |
![]() |
|
Power | At Duty Cycle 20%: 0.36 W At Duty Cycle 50%: 0.6 W At Duty Cycle 100%: 2.4 W |
![]() |
|
Air Flow | At Duty Cycle 20%: 9.24 CFM At Duty Cycle 50%: 18.48 CFM At Duty Cycle 100%: 30.80 CFM |
![]() |
|
Noise Level | At Duty Cycle 20%: 16 dBA At Duty Cycle 50%: 22 dBA At Duty Cycle 100%: 27.3 dBA |
![]() |
|
Air Pressure | At Duty Cycle 20%: 0.23 mm-H2O At Duty Cycle 50%: 10.93 mm-H2O At Duty Cycle 100%: 2.6 mm-H2O |
![]() |
|
Lead Wire Pin Out | Pin1-Black (-) Pin2-Yellow (+) Pin3-Green (Techometer/Signal output) Pin4-Blue (PWM) |
![]() |
|
Cooling Performance VS. Airflow (Wind Tunnel Simulation) | ![]() |
![]() |
|
Note | 1. Support CPU Power up to 65 Watts 2. Screw fastener Captive Mounting Type 3. Interference-free mounting backplate is included 4. Pre-print thermal compound TIG830SP 5. RoHS Compliance |