Loading... Please wait...Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded for 2U server & up solution up to TDP 205 Watts heat dissipation
| CPU Support |
Intel |
|---|---|
| CPU Socket |
FCLGA3647 |
| Solution |
2U Server and Up |
| Dimensions |
108.0 x 80.0 x 64.0 mm |
| Weight |
600 g |
| Material |
Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded |
| Thermal Grease |
Shin-Etsu 77 |