Loading... Please wait...Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.
| CPU Support |
Intel |
|---|---|
| CPU Socket |
Intel Purley – EP / EX, Socket LGA 3647 |
| Solution |
1U Server and Up |
| Dimensions |
90 x 90 x 27 mm |
| Weight |
420 g |
| Material |
Copper1100 Stacked Fin Heatsink with Vapor Chamber Base |
| Thermal Grease |
Shin-Etsu 7762 Pre-printed |