Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.
CPU Support |
Intel |
---|---|
CPU Socket |
Intel Purley – EP / EX, Socket LGA 3647 |
Solution |
1U Server and Up |
Dimensions |
90 x 90 x 27 mm |
Weight |
420 g |
Material |
Copper1100 Stacked Fin Heatsink with Vapor Chamber Base |
Thermal Grease |
Shin-Etsu 7762 Pre-printed |