Copper 1100 Vapor Chamber and Stacked Fin passive heatsink for 1U server solution up to TDP 180 Watts heat dissipation.
CPU Support |
AMD EPYC |
---|---|
CPU Socket |
SP3 |
Solution |
1U Server and Up |
Dimensions |
120 x 82 x 27 mm |
Weight |
450 g |
Material |
Copper 1100 with Skiving Fin |
Thermal Grease |
Shin-Etsu 7762 Pre-printed |